'JPT' Brand of Diamond Lapping Paste are manufactured from pure accurately graded diamond powder. JPT's diamond lapping paste achieves scratch free surface with the highest degree of super fine finish. Many additional forming compounds are readily available for specific applications with natural and synthetic diamond. This carrier have been specially formulated to maintain a constant viscosity over a wide temperature range, are heat resistant and thus ensures maximum utility of the diamond powder.
The above properties make the paste an efficient tool in the very high precision industries where finish and cleanliness are of importance. The lapping of computer read/write heads, tape recorder heads, optical lenses, watch jewels, sapphire, watch glass, tungsten carbide parts etc., can be successfully done with these compounds.
Available in 5 gram syringes and 50 gram containers in oil soluble and universally soluble and universally soluble base and in different concentration
High-Performance Diamond Compounds for Precision Lapping, Polishing & Superfinishing Applications
JPT Diamond Lapping Paste and Diamond Slurry are premium-grade precision finishing compounds manufactured using accurately graded natural and synthetic diamond micron powders for ultra-fine lapping, polishing, honing, and superfinishing operations.
These compounds are specially engineered for high-precision industries requiring:
JPT Diamond Compounds are extensively used in precision engineering, tool manufacturing, optics, semiconductor, carbide tooling, aerospace, medical, and die & mold industries.
JPT Diamond Lapping Paste is manufactured using:
The uniform distribution of diamond particles ensures:
Well-Graded Diamond Powder
Accurately classified diamond particles provide:
Practically all particles remain active during the lapping process, resulting in:
Poorly Graded Diamond Powder
Non-uniform diamond powders may cause:
Only oversized particles remain active while finer particles become ineffective.
Premium Diamond Micron Powder
Manufactured using:
Providing:
Controlled Particle Size Distribution
Diamond particles are:
Ensuring:
Heat Resistant Carrier System
Specially formulated carriers offer:
Water Soluble Diamond Paste
Completely soluble in:
Advantages:
Important Note
Excessive dilution may cause:
Oil Soluble Diamond Paste
Special low molecular weight formulation offering:
Recommended with:
High-Precision Diamond Suspension System
JPT Diamond Slurry is an advanced agglomerate-free suspension of diamond micron particles developed for critical polishing and flat lapping applications.
The slurry maintains:
Types of Diamond Slurry
Available in:
Diamond Paste available in:
Diamond Slurry available in:
Custom concentrations and formulations available on request.
JPT Diamond Compounds are capable of achieving ultra-fine surface finishes up to:
Ra < 0.05 µm
For Conventional Abrasive Finish (250–300 Mesh)
Recommended sequence:
D50 → D20 → D10 → D3
For ultra-super finishing:
D3 → D1
For Fine Abrasive Finish (400–600 Mesh)
Recommended sequence:
D30 → D10 → D3 → D1
Hard Lap Materials
Provide:
Suitable for:
Soft Lap Materials
Provide:
Suitable for:
Roughing Operations
Medium Cutting Operations
Pre-Polishing & Superfinishing
Standard Concentration
Recommended for:
High Concentration
Recommended for:
Material Hardness Recommendation
For materials above:
HRC > 50
Use:
For materials below:
HRC < 50
Use:
Tool & Die Industry
Used for:
Bearing Industry
Suitable for:
Optical Industry
Used in:
Semiconductor Industry
Applied in:
Watch & Jewellery Industry
Used for:
Precision Engineering Industry
Suitable for:
The performance of diamond lapping compounds depends upon:
Machine Speed
Recommended operating speed:
2000–4000 RPM
For:
Excessive speed may cause:
Clean Working Environment
Essential for:
Separate Laps for Each Grade
Never interchange laps between different grit sizes to avoid:
Cross-Cut Polishing Method
Successive polishing operations should:
Diamond Paste Grades
Product Variants
Custom grit sizes, concentrations, viscosities, and packaging available as per customer application requirements.

